Our MLLabel laser modules are used for laser cutting and optionally also for perforating and marking labels and adhesive foils.
Using our MLLabel CO2 laser cutting system, labels can be cut out of the carrier film at breathtaking speed.
By means of precise and very stable laser settings, the self-adhesive layer of the labels can be cut exactly. The cutting shapes are flexible and can be designed almost at will using MLT software. The carrier material, the so-called liner, is not damaged in the process, as the laser beam can be controlled extremely precisely in depth.
Optionally, additional laser sources with other wavelengths, such as UV lasers, can be integrated. These are then used for permanent marking of the labels. 2D and 3D barcodes, matrix codes, logos or serial numbers are typical marking patterns.
Individual patterns can be incorporated into the labels by means of perforation. These often serve as an additional security feature and protection against plagiarism.
Examples of applications for the MLLabel laser modules are: